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Bit Error Rate Performance Of Intra Chip Wireless Interconnect Systems

Please try the request again. He hasauthored or coauthored over 200 refereed journal and conference papers,two books, and several book chapters.Dr. This experimentdemonstrates the functionality of the FDMA/CDMA-inter-connect including RF and digital transceivers, signal cou-pling, and transmission.IV. The system returned: (22) Invalid argument The remote host or network may be down. http://gatoisland.com/bit-error/bit-error-rate-performance.php

The intended miniature LAN contains ULSI I/Osas users, capacitive couplers as near-field antennas, RF cir-cuits for transceivers, and an off-chip butin-package MTL orCPW as a shared broadcasting medium. Herrick, “Si-micromachining in MM-wavecircuits,” in Proc. 1997 Topical Symp. To meet scalability demands, this paper addresses the systemlevel challenges for intra-chip multicast communication in a proposed hybrid interconnects architecture. In each transmitter, input data is spread by Walshcodes and then transmitted in-and-out of a shared transmis-sion line through T/R couplers.

This trend is clearlyindicated in the rapid growth of system-oriented products,including complete systems on a chip, and/or MCMs. In addition,464 PROCEEDINGS OF THE IEEE, VOL. 89, NO. 4, APRIL 2001 the communication channel may be further selected inthe direct conversion receiver with low pass filters. Moreover, this paper embeds novel multicast routing and arbitration schemes to address system-level multicast-challenges in the proposed architecture. US & Canada: +1 800 678 4333 Worldwide: +1 732 981 0060 Contact & Support About IEEE Xplore Contact Us Help Terms of Use Nondiscrimination Policy Sitemap Privacy & Opting Out

Output signals canbe up-linked to MTL or CPW via transmission capacitivecouplers (), then down-linked via receiving capacitivecouplers () to input ports to fulfill the interconnectfunction. Signal-to-noise budget for the intended RF/wirelessinterconnect system.lower than that of the thermal noise in an open-air wire-less interconnect using antenna to transmit and receive sig-nals without shielding [12]. The parasitic resis-tance, capacitance, and inductance associated with intercon-nects are beginning to influence the circuit performance andhave increasingly become one of the primary showstoppersManuscript received July 19, 2000; revised December 16, The signal line of the CPW isdesigned to be 100m wide with 20- m signal-to-groundisolation gaps [8].

The worst case is simulated by placingand at the opposite end of the CPW and therest of 20/20uniformly across the transmission line.Assuming(5 k ) and, we find the loss caused by One can in principleachieve such a shared network using optical intercon-nects; however, the overheads incurred per I/O in termsof area, power, and integration difficulties may be morechallenging compared with our RF-based The decrease in minimum fea-ture size of devices has led to a proportional decrease in in-terconnect cross-sectional area and pitch. US & Canada: +1 800 678 4333 Worldwide: +1 732 981 0060 Contact & Support About IEEE Xplore Contact Us Help Terms of Use Nondiscrimination Policy Sitemap Privacy & Opting Out

CPW must be properly terminated with tominimize the frequency dispersion.B. Currently, he is conducting research on theRF/wireless interconnect for next generation ULSI applications. ULSI chips communicate with each other through aminiature wireless LAN inside a MCM package.Fig. 4. patents.Dr.

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Nevertheless, merely metalbased NoC implementation offers only limited performance and power scalability in terms of multicast and broadcast traffics. More about the author One can then use thearchitecturalflexibilityto program avirtual machineontheresulting hardwarebyfirsttesting andthen followedby reconfiguration. The frequency dispersion of these interconnectsalso reaches 30–40 dB across the same frequency range.Time-domain simulations in Fig. 2(a) confirm the integrityof transmitted square-wave signals through a 1-cm-longCPW, in contrast to the Using frequency and/or code divisionmultiplexing, one can achieve multiple access in ourscheme, while maintaining reliability.

A representative RF/wireless interconnect channel withmultiple I/Os.total propagation distance;complex propagation coefficient with its real partexpressed as(4)whererepresents the effective permittivity of di-electrics which surround the transmission line [6], [8], [9].When the transmission Full-text · Article · Jul 2016 Jinglei HuangSong ChenWei Zhong+2 more authors ...Fujiang LinRead full-textNetwork-on-Chip Multicast Architectures Using Hybrid Wire and Surface-Wave Interconnects"In addition, Power dissipation for wire links is calculated J. http://gatoisland.com/bit-error/bit-error-rate-performance-of-bpsk.php F.

Skip to Main Content IEEE.org IEEE Xplore Digital Library IEEE-SA IEEE Spectrum More Sites Cart(0) Create Account Personal Sign In Personal Sign In Username Password Sign In Forgot Password? Fortunately, the real estate and powerconsumption of these circuits are insignificant withadvanced CMOS, as demonstrated in Section II. Chang, “Extremely high-Qtunable inductor for Si-based RF integrated circuit applications,” inDig.1997 Int.

The RF part of theinterconnect transceiveris similar to that of the FDMA trans-ceiver.The Walsh code generator creates a set of mutually or-thogonal codes asshown in Fig. 17.

A good compro-mise can be reached by choosingk and. Beforejoining UCLA, he was the Assistant Director and Manager of the HighSpeed Electronics Laboratory at the Rockwell Science Center (1983–1997),Thousand Oaks, CA. The system returned: (22) Invalid argument The remote host or network may be down. Register now for a free account in order to: Sign in to various IEEE sites with a single account Manage your membership Get member discounts Personalize your experience Manage your profile

Thiswork was supported undercontracts and grants from DARPA/SPAWAR andSRC.The authors are with the High Speed Electronics Laboratory, Departmentof Electrical Engineering, University of California, Los Angeles, CA90095-1594 USA (e-mail: [email protected]; [email protected];[email protected]; [email protected]; He joined Institute of Electronics,Chinese Academy of Science, Beijing, China,as an Associate Research Professor in 1994and a Research Professor in 1997. It isalso noted that the power consumption ofoutputstage, which is usually determined by the receiversensitivity, does not scale as the digital circuitry. news and Ph.D.

Consequently, the hybrid wire-SWI architecture avoids overloading the network, alleviates the formation of traffic hotspots and avoid deadlocks that are typically associated with state-of-theart multicast handling. In this article, we propose a four-stage floorplanning and topology synthesis approach for ASNoCs with Radio-Frequency Interconnect (RF-I). Use of this web site signifies your agreement to the terms and conditions. This assumption is supported by a recentstudy which measured the digital switching noise to be 10 dB460 PROCEEDINGS OF THE IEEE, VOL. 89, NO. 4, APRIL 2001 Fig. 13.

Kim, B.

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